This is the second in a series of articles tracking government chip investments. See part one here. Since the first ...

Aware Evaluation and Optimization of 3D IC Architecture with Digital Compute-in-Memory Designs” was published by researchers at Cornell University. “In this paper, we investigate digital CIM (DCIM) ...

A new technical paper titled “Electron Microscopy-based Automatic Defect Inspection for Semiconductor Manufacturing: A ...

D-printed active electronics; edible toothpaste-based transistor; solution deposition for large-scale electronics.

Is EDA meant to react to the needs of the industry, or anticipate its needs and develop ahead of the curve? The balance point ...

The semiconductor industry increasingly needs more flexible and scalable processor architectures, driving the growing ...

LLMs require a secure environment As with any LLM, a hardware-security oriented program can only generate results as good as ...

A new technical paper titled “Image Sensors and Photodetectors Based on Low-Carbon Footprint Solution-Processed ...

Arm joined forces with Korea’s Samsung Foundry, ADTechnology, and Rebellions to create a CPU chiplet platform for AI training and inference. The new chiplet will be based on Samsung’s 2nm ...

A new technical paper titled “Signal processing architecture for a trustworthy 77GHz MIMO Radar” was published by researchers ...

A new technical paper titled “An efficient device model for ferroelectric thin-film transistors” was published by researchers ...

A new technical paper titled “Semiconductor-free, monolithically 3D-printed logic gates and resettable fuses” was published ...