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Design-Reuse
7h
InPsytech Announces Finalization of UCIe IP Design, Driving Breakthroughs in High-Speed Transmission Technology
The next-generation UCIe physical layer IP, based on TSMC's N4 process, is expected to finalize its design later this year, ...
Design-Reuse
22h
YorChip and ChipCraft announce low-cost, high-speed 200Ms/s ADC Chiplet
YorChip, Inc. and Chipcraft announce development of a low cost, low power 8 bit 200Ms/s ADC Chiplet. Currently no ultra-low ...
Design-Reuse
23h
Chip Interfaces Successfully Completes Interlaken IP Interoperability Test with Cadence 112G Long-Reach PHY
This milestone marks a significant achievement in ensuring seamless integration and reliable data transfer between the two ...
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