This is the second in a series of articles tracking government chip investments. See part one here. Since the first ...
A new technical paper titled “Electron Microscopy-based Automatic Defect Inspection for Semiconductor Manufacturing: A ...
Aware Evaluation and Optimization of 3D IC Architecture with Digital Compute-in-Memory Designs” was published by researchers at Cornell University. “In this paper, we investigate digital CIM (DCIM) ...