But it seems Taiwanese megfab TSMC is determined to crank out new silicon regardless. The latest reports claim TSMC's ...
In recent years, the Japanese government has concentrated its semiconductor subsidy investments primarily on chip ...
Rapidus tackles three major challenges; initial production yield target set at 50%: Summary Rapidus is gearing up to supply Broadcom with 2nm chip prototypes by June 2025, paving ...
TSMC plans to build 2nm chips at one of its U.S. fabs in Arizona by 2028. As great as that sounds for U.S. tech companies ...
This marks a significant shift from past policies designed to safeguard Taiwan's leadership in semiconductor manufacturing.
Lam Research Corporation  today announced that its innovative dry photoresist (dry resist) technology has been qualified for direct-print 28nm pitch back end of line (BEOL) logic at 2nm and below by ...